Kulicke and Soffa Industries, Inc.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.

Flexline

Your product quality is our drive.

With the Flexline you can create the ideal high quality production line for any mix, any volume, any product. The renowned AX system has been re-vamped into the next generation iX platform, ensuring full commonality with the existing iFlex and still focusing on what it does best;  pick and place components at the highest possible quality levels, a requirement for industries focusing on safety, liability sensitive, life critical or high service call type of products.

Flexline exists of the following modules that can be combined into any desired production line:

  • iX 502 – high passive and small IC outputs up to 121,000 cph
  • iX 302 – high passive and small IC outputs up to 79,000 cph
  • iFlex T4 – Dual and single lane solution with high passive andsmall IC (up to 17,5 x 17,5mm) outputs up to 51,000 cph
  • iFlex T2 – Dual and single lane multifunctional or line-balancing solution with large component range
  • iFlex H1 – Dual and single lane end-of-line solution with oddform and gripper capabilities

Advanced Packaging Mass Reflow

PCB assembly meets Backend die placements. With actual passive shooting speeds of up to 121,000 passives per hour and flip chip shooting up to 27,000 flip chips per hour at placement defect rates lower than 1 defect per million, the Hybrid solutions gives you the best of both worlds.